- EMI/RFI Products
- Shielding Gaskets and Tapes
- EMI Grounding Washers
- Shielded Ventilation Panels
- Conductive Silicone
- EMI Shielded Windows
- Board Level Shields
- Thermal Management Materials
- Absorber Materials
Thermal Management Materials (6004 Series)
This material exhibits very high thermal conductivity. In addition, this material exhibits high compressibility and natural adhesiveness. It is excellent for applications where electrical insulation and thermal conductivity is needed.
The exceptional ability of this material to conduct heat away from sensitive components makes it applicable for use in very heat sensitive applications. The 6004 is an excellent high-level thermal conductive interface material.
|Thickness||0.13 – 15||mm||ASTM D374|
|Specific Gravity||2.28 +/-0.2||g/cm3||ASTM D792|
|Hardness||20 +/-5||Shore A||ASTM D2240|
|Elongation||130 +/-13||%||ASTM D412|
|Tensile Strength||8 +/-2||Kgf/cm2||ASTM D412|
|Weight Loss||<1||%||@204oC/24 hr.|
|Dielectric Breakdown (V)||>7.0||KV||ASTM D149|
|Surface Resistance||1017||Ohm||ASTM D257|
|Temperature Continuous||-50 to +220||oC||–|
|Thermal Conductivity||3.2||W/m-k||ASTM D5470|
Test Sample Thickness: 1.5mm
Thermal Resistance vs. Pressure (Gray)
The 6004 material provides low thermal impedance; with increasing pressure, thermal impedance becomes lower.
Deflection vs. Pressure (Black)
The 6004 material, exhibits high deflection (softness); as pressure increases the deflection percentage increases. This material provides good compliance to mating surfaces.